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文獻筆記(5)(2017ISSCC 14.1)

文獻摘自A 2.9TOPS/W Deep Convolutional Neural Network SoC in FD-SOI 28nm for Intelligent Embedded Systems

1 英文縮寫

  • DCNN: deep convolutional neural networks
  • HW: hardware
  • DMA: 直接記憶體訪問
  • CAF: configurable accelerator framework
  • CA: convolution accelerator
  • MAC: multiply-accumulate

2 overall architecture

We present a state-of-the-art performance and energy efficient HW-accelerated DCNN processor with the following features:

  • An energy-efficient set of DCNN HW convolutional accelerators supporting kernel compression

  • an on-chip reconfigurable data-transfer fabric

  • a power-efficient array of DSPs to support complete real-world computer vision applications

  • an ARM-based host subsystem with peripherals(外圍裝置)

  • a range of high-speed IO interfaces for imaging and other types of sensors

  • a chip-to-chip multilink(多鏈路) to pair multiple devices together SoC top-level block diagram

  • ARM Cortex microcontroller with 128KB of memory

  • 不同的外圍裝置

  • 8 DSP clusters

    • 每個DSP cluster有2 DSP, 4-way 16KB instruction caches, 64KB local RAMs and a 64KB shared RAM
  • Image&CDNN co-processor subsystem

2 accelerator subsystem

  • a configurable fully connected switch to/from different kinds of sources/sinks
  • various types of accelerators - Various kernel sizes (up to 12×12), batch sizes (up to 16), and parallel kernels (up to 4) can be handled by a single CA instance, but any size kernel can be accommodated with the accumulator input.

3 convolutional accelerator

  • a line buffer to fetch up to 12 feature map data words in parallel with a single memory access
  • 最大kernel size:12*12,但是kernel buffer 有36個讀埠 在這裡插入圖片描述

4 DSP cluster

32bit DSP The DSPs are tasked with max or average pooling, nonlinear activation, cross-channel response normalization and classification.